The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Oct. 27, 2006
Wen-hung HU, Hsin-chu, TW;
Ying-tung Wang, Hsin-chu, TW;
Shih-ping Hsu, Hsin-chu, TW;
Chao-wen Shih, Hsin-chu, TW;
Wen-Hung Hu, Hsin-chu, TW;
Ying-Tung Wang, Hsin-chu, TW;
Shih-Ping Hsu, Hsin-chu, TW;
Chao-Wen Shih, Hsin-chu, TW;
Phoenix Precision Technology Corporation, Hsin-Chu, TW;
Abstract
Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically.