The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Feb. 05, 2008
Wei-hung Lin, Hsinchu, TW;
Zao-kuo Lai, Hsinchu, TW;
Wei-Hung Lin, Hsinchu, TW;
Zao-Kuo Lai, Hsinchu, TW;
Phoenix Precision Technology Corporation, Hsinchu, TW;
Abstract
Method for making a coreless packaging substrate are disclosed in the present invention. The coreless packaging substrate is made by first providing a metal adhesion layer having a melting point lower than that of the substrate, and removing a core board connected with the substrate therefrom through melting the metal adhesion layer. In addition, the disclosed packaging substrate further includes a circuit built-up structure of which has the electrical pads embedded under a surface. The disclosed packaging substrate can achieve the purposes of reducing the thickness, increasing circuit layout density, and facilitating the manufacturing of the substrate.