Hsin-Chu, Taiwan

Zao-Kuo Lai


Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 39(Granted Patents)


Company Filing History:


Years Active: 2006-2011

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5 patents (USPTO):

Title: Zao-Kuo Lai: Innovator in Semiconductor Packaging

Introduction

Zao-Kuo Lai is a prominent inventor based in Hsin-Chu, Taiwan, known for his contributions to the field of semiconductor packaging. With five patents to his name, Lai has made significant advancements in the design and manufacturing of chip carrier structures and coreless packaging substrates.

Latest Patents

Lai's recent innovations include a patent for a chip carrier structure that features a semiconductor chip embedded within it and a protective metal layer formed on its surface. This invention provides improved moisture resistance, minimizes delamination, offers a shielding effect, and enhances heat dissipation through its metal layer. Additionally, his work on the method for manufacturing a coreless packaging substrate showcases a novel technique that utilizes a metal adhesion layer to facilitate the reduction of substrate thickness and increase circuit layout density. These patents highlight his impactful contributions to semiconductor technology.

Career Highlights

Zao-Kuo Lai has worked with notable companies including Phoenix Precision Technology Corporation and Unimicron Technology Corporation, where he has played a vital role in research and development. His experience in these companies has contributed to his understanding and innovation within the semiconductor industry.

Collaborations

Throughout his career, Lai has collaborated with esteemed colleagues such as Lin-Yin Wong and Chia-Wei Chang. Their joint efforts have further advanced research in semiconductor technologies and enhanced the performance and efficiency of packaging substrates.

Conclusion

Zao-Kuo Lai continues to be a trailblazer in the innovation of semiconductor packaging solutions. His patents not only exhibit his deep knowledge and expertise but also signify his commitment to pushing the boundaries of technology in the electronics industry. As he advances his research, the impact of his work will continue to be felt in the development of next-generation semiconductor devices.

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