The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Aug. 04, 2006
Chia-wei Chang, Hsin-chu, TW;
Lin-yin Wong, Hsin-chu, TW;
Zao-kuo Lai, Hsin-chu, TW;
Chung-cheng Lien, Hsin-chu, TW;
Chia-Wei Chang, Hsin-chu, TW;
Lin-Yin Wong, Hsin-chu, TW;
Zao-Kuo Lai, Hsin-chu, TW;
Chung-Cheng Lien, Hsin-chu, TW;
Phoenix Precision Technology Corporation, Hsin-Chu, TW;
Abstract
A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having at least one through hole, are provided. A first protecting layer and a second protecting layer are formed on a surface of the first and second carrier boards respectively. At least one first semiconductor component and at least one second semiconductor component are disposed on the first and second protecting layers and accommodated in the first and second through holes respectively. A dielectric layer is laminated between the surfaces of the first and second carrier boards without the protecting layers formed thereon. Thus, a modularized package structure with reduced space waste is formed.