Kan-Jung Chia

Title: **Innovations by Kan-Jung Chia: Pioneering Embedded Semiconductor Packaging**

Introduction

Kan-Jung Chia, a notable inventor based in Hsin-Chu, Taiwan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 17 patents, Chia's innovations are at the forefront of advancements in packaging structures for integrated circuits.

Latest Patents

Among his latest patents is a method for fabricating a packaging structure with an embedded semiconductor element. This innovative process involves several steps, starting with the provision of a substrate that features opposite first and second surfaces and at least one opening that penetrates through both surfaces. A first metallic frame is created around the opening to precisely control its shape. With the help of laser ablation, additional openings are formed, allowing for the proper disposal of a semiconductor chip within the substrate. This method ensures that the chip is securely embedded, enhancing the performance and reliability of electronic devices.

Another notable patent by Chia includes a comprehensive packaging structure that features an embedded semiconductor element. This design includes the provision of a substrate with precisely controlled openings, ensuring optimal placement of the semiconductor chip. With dielectric layers and wiring structures in place, the design further showcases Chia's expertise in semiconductor packaging technology.

Career Highlights

Kan-Jung Chia has worked with leading companies in the semiconductor industry, including Unimicron Technology Corporation and Phoenix Precision Technology Corporation. His experience in these organizations has significantly contributed to his development as an inventor, allowing him to refine his skills and focus on creating innovative solutions.

Collaborations

Throughout his career, Chia has collaborated with esteemed colleagues such as Shih-Ping Hsu and Shang-Wei Chen. These partnerships have enriched his work and enabled him to push the boundaries of what is possible in semiconductor technology.

Conclusion

Kan-Jung Chia's impressive collection of patents and his work within the industry position him as a key figure in semiconductor innovation. Through his expertise and collaborative efforts, he continues to pave the way for advancements in packaging structures, reinforcing the importance of innovation in technology.