The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Sep. 04, 2009
Kan-jung Chia, Hsin-Chu, TW;
Kan-Jung Chia, Hsin-Chu, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A package substrate having a semiconductor component embedded therein and a method of fabricating the same are provided, including: providing a semiconductor chip with electrode pads disposed on an active surface thereof; forming a passivation layer on the active surface and the electrode pads; forming on the passivation layer metal pads corresponding in position to the electrode pads, respectively, so as for the semiconductor chip to be fixed in position to an opening of a substrate body; forming a first dielectric layer on the semiconductor chip and the substrate body; forming dielectric layer openings by laser and preventing the electrode pads from being penetrated by the metal pads; removing the metal pads and the passivation layer in the dielectric layer openings so as to expose the electrode pads therefrom; and forming a first wiring layer on the first dielectric layer for electrical connection with the electrode pads.