The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2010

Filed:

Dec. 10, 2007
Applicant:

Kan-jung Chia, Hsin-feng, Hsinchu, TW;

Inventor:

Kan-Jung Chia, Hsin-feng, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
Abstract

A carrier structure embedded with semiconductor chips is disclosed, which comprises a core board and a plurality of semiconductor chips mounted therein. The core board comprises two metal plates between which an adhesive material is disposed. An etching stop layer is deposited on the both surfaces of the core board. Pluralities of cavities are formed to penetrate through the core board. The semiconductor chips each have an active surface on which a plurality of electrode pads are disposed, and those are embedded in the cavities and mounted in the core board. An etching groove formed on the core board between the neighboring semiconductor chips is filled with the adhesive material. The present invention avoids the production of metal burrs when the carrier structure is cut.


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