The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Jan. 28, 2022
Applicant:

Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;

Inventor:

Shih-Ping Hsu, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 49/02 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01F 27/2852 (2013.01); H01F 27/327 (2013.01); H01F 41/04 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/645 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01);
Abstract

An inductor structure is provided. A plurality of first and second conductive posts have end surfaces corresponding in profile to ends of first conductive sheets, respectively. As such, the profiles of the end surfaces of the first and second conductive posts are non-cylindrical so as to increase the contact area between the first conductive sheets and the first and second conductive posts, thereby improving the conductive quality and performance of the inductor. Further, since the first and second conductive posts are formed by stacking a plurality of post bodies on one another, the number and cross-sectional area of loops are increased so as to increase the inductance value. A method for fabricating the inductor structure, an electronic package and a fabrication method thereof, and a method for fabricating a packaging carrier are further provided.


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