The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Nov. 24, 2020
Applicant:

Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;

Inventors:

Chao-Tsung Tseng, Hsinchu County, TW;

Che-Wei Hsu, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); G06F 30/398 (2020.01); G06V 40/16 (2022.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); G06F 30/398 (2020.01); G06V 40/16 (2022.01); H01L 23/49506 (2013.01);
Abstract

A sensing device includes a sensing chip, which has an active face with a sensing region and a metal pad region having at least a metal pad thereon; a dielectric layer, which covers a periphery, back surface and a part of the active surface of the sensing chip, and the first face of the dielectric layer has an elevation higher than the active face of the sensing chip and exposes the sensing region of the sensing chip; a first conductive wire layer and a second conductive wire layer, which are disposed on the first and second faces of the dielectric layer respectively; a conductive pillar, which is disposed within the dielectric layer and connected to the first and second conductive wire layers; and a front-face fan-out circuit, which is connected to the first conductive wire layer and the metal pad of the sensing chip.


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