Che-Wei Hsu

This inventor holds 37 USPTO granted patents and 17 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging. Top assignees: Phoenix Pioneer Technology Co., Ltd., Phoenix LLC, Zhen Ding Technology Co., Ltd.. Active years: 2015-2026.

USPTO Granted Patents = 37 (Patent Applications = 17)

% Patents Active = 97.3

EPO Patents = 3 (Patent Applications = 2)

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 29(Granted Patents)

Location History:

Hukuo Township, TW (2016)
Hukou Township, TW (2017)
Taoyuan, TW (2015 - 2020)
Hsinchu County, TW (2015 - 2024)

Company Filing History:

29 out of 76

Phoenix Pioneer Technology Co., Ltd.

Zhen Ding Technology Co., Ltd.

patents

4. 1 out of 4

Phoenix Pioneer Technology Co., Ltd.

patents

5. 1 out of 1,902

Quanta Computer Incorporated

patents

Years Active: 2015-2026

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Areas of Expertise:

Semiconductor Package

Antenna Structure

Manufacturing Method

Electronic Package

Surface Acoustic Wave Filter

Interposer Substrate

Flip-Chip Package

Heat Dissipating Element

Bump Structures

Sensor Package

Circuit Board

Substrate Structure

37 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12660637 - Package carrier board integrated with inductive circuit structure and manufacturing method thereof (2026-06-16),

2. 12519039 - Sensing device and manufacturing method thereof (2026-01-06),

3. 12347919 - Semiconductor package antenna structure and its manufacturing method (2025-07-01),

4. 12272653 - Semiconductor packaging substrate and manufacturing method thereof (2025-04-08),

5. 12100665 - Semiconductor package structure and manufacturing method thereof (2024-09-24),

6. 12080670 - Manufacturing method of semiconductor package structure (2024-09-03),

7. 12080466 - Electronic package (2024-09-03),

8. 11798909 - Semiconductor package structure and manufacturing method thereof (2023-10-24),

9. 11757426 - Manufacturing method for surface acoustic wave filter package structure (2023-09-12),

10. 11605237 - Smart card fingerprint recognition module packaging structure and manufacturing method thereof (2023-03-14),

11. 11552014 - Semiconductor package structure and method of making the same (2023-01-10),

12. 11387806 - Surface acoustic wave filter package structure and method of manufacturing the same (2022-07-12),

13. 11222880 - Package structure for semiconductor device and manufacturing method thereof (2022-01-11),

14. 11081435 - Package substrate and flip-chip package circuit including the same (2021-08-03),

15. 11031329 - Method of fabricating packaging substrate (2021-06-08),

Title: The Innovative Journey of Che-Wei Hsu

Introduction:

Che-Wei Hsu, a talented inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents:

Che-Wei Hsu holds several patents in the areas of electronics, semiconductor technology, and renewable energy solutions, showcasing his diverse expertise and forward-thinking approach.

Career Highlights:

With a background in engineering and a passion for problem-solving, Che-Wei Hsu has had a successful career marked by groundbreaking inventions and cutting-edge developments. His work has not only revolutionized industries but has also improved the lives of many.

Collaborations:

Throughout his career, Che-Wei Hsu has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life. His ability to work in multidisciplinary teams has led to the creation of innovative solutions that have had a lasting impact.

Conclusion:

In conclusion, Che-Wei Hsu's innovative spirit, coupled with his dedication to pushing the boundaries of technology, has solidified his position as a respected inventor in the global innovation landscape. His work continues to inspire future generations of inventors and innovators.