The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Aug. 12, 2022
Applicant:

Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;

Inventor:

Che-Wei Hsu, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
G06V 40/1306 (2022.01); G06V 40/13 (2022.01);
Abstract

A smart card fingerprint identification module packaging structure includes a first insulating layer, an insulating protective layer, a shielding layer, a second insulating layer, a fingerprint sensing area and bump pads. A first patterned circuit layer is embedded in the first insulating layer, and part of this layer serves as a first sensing circuit. A second patterned circuit layer is disposed on the second surface of the first insulating layer, and part of this layer serves as a second sensing circuit. A patterned metal layer is disposed on the second insulating layer and covers the outer surface of the second insulating layer as a shielding layer. The shielding layer corresponding to the first and the second sensing circuits is hollowed out to serve as a fingerprint sensing area. The longitudinal projections of the first sensing circuit and the second sensing circuit are staggered from each other without overlapping.


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