The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Aug. 31, 2022
Applicant:
Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;
Inventor:
Che-Wei Hsu, Hsinchu County, TW;
Assignee:
PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2885 (2013.01); H01F 27/2804 (2013.01); H01F 41/042 (2013.01); H01F 41/043 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 24/24 (2013.01); H01L 25/16 (2013.01); H01L 28/10 (2013.01); H01F 2027/2809 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/244 (2013.01); H01L 2224/245 (2013.01); H01L 2924/01029 (2013.01);
Abstract
An electronic package is provided and includes an electronic element connected to a plurality of inductor circuits embedded in an insulator of a package substrate by fan-out conductive copper pillars, and at least one shielding layer non-electrically connected to the inductor circuits, where the shielding layer includes a plurality of line segments not connected to each other, such that the shielding layer shields the inductor circuits, thereby achieving the electrical requirements of high-current products while improving the inductance value and quality factor.