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Forward Citations = 3

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9 inventors (with patents filed for the assignee):

Yu-Cheng Huang (5 out of 14 patents)

Mao-Feng Hsu (1 out of 12 patents)

Kuo-Sheng Liang (1 out of 2 patents)

4. Mei-Ju Pan (1 out of 1 patent)

5. Wei-Shuo Su (1 out of 5 patents)

6. Yi-Ho Chen (1 out of 1 patent)

7. Shih-Ping Hsu (1 out of 164 patents)

8. Chin-Ming Liu (1 out of 4 patents)

9. Chun-Chieh Huang (1 out of 2 patents)

9 patents: Sort by Forward Citations

1. 11683888 - Method for manufacturing a packaged circuit structure (2023-06-20),

2. 10501664 - Resin compositon, removable adhesive layer, IC substrate, and IC packaging process (2019-12-10),

3. 10412835 - Package substrate (2019-09-10),

4. 9992873 - Method of manufacturing a package substrate (2018-06-05),

5. 9905508 - Package structure (2018-02-27),

6. 9855629 - Heat sink, method for making the same, and electronic device having the same (2018-01-02),

7. 9735097 - Package substrate, method for making the same, and package structure having the same (2017-08-15),

8. 9730328 - Printed circuit board with embedded component and method for manufacturing same (2017-08-08),

9. 9548427 - Package structure and method for manufacturing same (2017-01-17),

Qi Ding Technology Qinhuangdao Co., Ltd. is a leading provider of innovative technological solutions in Qinhuangdao. Specializing in the development and production of advanced electronic devices, our company is dedicated to delivering high-quality products to meet the demands of today's rapidly changing market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

9 Patents

#4 in Qinhuangdao

#2,742 in China

Qinhuangdao, China

Qi Ding Technology Qinhuangdao Co., Ltd.