The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Dec. 14, 2015
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;

Fukui Precision Component (Shenzhen) Co., Ltd., Shenzhen, CN;

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Inventor:

Yu-Cheng Huang, New Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H05K 3/04 (2006.01); H05K 3/20 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0298 (2013.01); H05K 3/0038 (2013.01); H05K 3/0058 (2013.01); H05K 3/045 (2013.01); H05K 3/20 (2013.01); H05K 3/303 (2013.01); H05K 3/46 (2013.01); H05K 3/007 (2013.01); H05K 3/06 (2013.01); H05K 2203/025 (2013.01);
Abstract

A circuit board includes a dielectric layer, a first circuit layer, a second circuit layer and at least an electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located outsides the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths thereof gradually decreasing along the extension direction. A method for manufacturing the circuit board is also provided.


Find Patent Forward Citations

Loading…