The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

Aug. 25, 2015
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co.,ltd., Qinhuangdao, CN;

Fukui Precision Component (Shenzhen) Co., Ltd., Shenzhen, CN;

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Inventor:

Yu-Cheng Huang, New Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); H01L 23/427 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
B23P 15/26 (2013.01); H01L 21/4882 (2013.01); H01L 23/427 (2013.01); B23P 2700/10 (2013.01);
Abstract

A heat sink includes a connecting member, a first substrate, a second substrate, and a cooling medium. The connecting member is sandwiched between the first substrate and the second substrate, and defines at least one hole passing through the connecting member. Each hole includes a first end and a second end respectively enclosed by the first substrate and the second substrate to define a cavity. The cooling medium is filled in each cavity.


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