The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Mar. 04, 2020
Industrial Technology Research Institute, Hsinchu, TW;
Kuo-Shu Kao, Hsinchu, TW;
Tao-Chih Chang, Taoyuan, TW;
Wen-Chih Chen, Hsinchu County, TW;
Tai-Jyun Yu, Taoyuan, TW;
Po-Kai Chiu, Taoyuan, TW;
Yen-Ting Lin, Hsinchu, TW;
Wei-Kuo Han, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.