Hsinchu, Taiwan

Wen-Chih Chen


Average Co-Inventor Count = 3.3

ph-index = 4

Forward Citations = 109(Granted Patents)


Location History:

  • Yilan, TW (2004 - 2006)
  • Renwu Township, Kaohsiung County, TW (2006 - 2009)
  • Hsin Chu Hsien, TW (2012)
  • Hsinchu, TW (2005 - 2018)
  • Hsinchu County, TW (2012 - 2023)

Company Filing History:


Years Active: 2004-2025

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17 patents (USPTO):Explore Patents

Title: Innovations of Wen-Chih Chen

Introduction

Wen-Chih Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of technology, particularly in power modules and chip packaging. With a total of 17 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is a power module that includes a power circuit board, a signal pin, a shielding substrate, and an electrically insulating component. The design ensures that the signal pin is properly positioned and insulated, enhancing the module's performance. Another notable patent is a chip package that features a heat-dissipating device, a thermal interface material layer, and an insulating encapsulant. This innovative design improves the efficiency and reliability of chip packaging.

Career Highlights

Wen-Chih Chen has worked with esteemed organizations such as the Industrial Technology Research Institute and Asia Pacific Microsystems, Inc. His experience in these companies has allowed him to develop and refine his inventions, contributing to advancements in technology.

Collaborations

Throughout his career, Wen-Chih has collaborated with talented individuals, including Tao-Chih Chang and Kuo-Shu Kao. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Wen-Chih Chen's contributions to technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in power modules and chip packaging.

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