The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Apr. 03, 2013
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); B23K 35/24 (2006.01); B32B 15/01 (2006.01); B23K 35/28 (2006.01); B23K 35/30 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
B23K 35/24 (2013.01); B23K 35/282 (2013.01); B23K 35/302 (2013.01); B23K 35/3013 (2013.01); B32B 15/01 (2013.01); B32B 15/018 (2013.01); H01L 23/49513 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 23/3735 (2013.01); H01L 23/49582 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/2612 (2013.01); H01L 2224/27826 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29561 (2013.01); H01L 2224/29565 (2013.01); H01L 2224/29582 (2013.01); H01L 2224/29583 (2013.01); H01L 2224/29639 (2013.01); H01L 2224/29644 (2013.01); H01L 2224/29647 (2013.01); H01L 2224/29663 (2013.01); H01L 2224/29664 (2013.01); H01L 2224/29669 (2013.01); H01L 2224/29673 (2013.01); H01L 2224/29676 (2013.01); H01L 2224/29678 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32503 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01); Y10T 428/12792 (2015.01);
Abstract
A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.