Hsinchu, Taiwan

Kuo-Shu Kao

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.9

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Hsinchu, TW (2011 - 2023)
  • Zhubei, TW (2023)

Company Filing History:


Years Active: 2011-2025

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14 patents (USPTO):

Title: **Kuo-Shu Kao: Innovator in Advanced Chip Packaging Solutions**

Introduction

Kuo-Shu Kao, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of chip packaging technology. With a total of 11 patents to his name, he has demonstrated a remarkable ability to innovate and improve existing technologies in the semiconductor industry.

Latest Patents

Among Kuo-Shu Kao's latest innovations is a cutting-edge chip package design. This chip package features a heat-dissipating device coupled with a first thermal interface material layer that is crucial for effective thermal management. The design includes a patterned circuit layer placed atop the first thermal interface material, with a chip that is electrically connected to the patterned circuit layer. An insulating encapsulant protects the chip, the patterned circuit layer, and the thermal interface material. Notably, the thickness of the first thermal interface material layer ranges between 100 μm and 300 μm, strategically positioned between the patterned circuit layer and the heat-dissipating device to enhance performance.

Career Highlights

Kuo-Shu Kao has had an impactful career, with pivotal roles in reputable organizations such as the Industrial Technology Research Institute and the Taiwan TFT LCD Association. His work in these institutions has allowed him to push the boundaries of technology in both research and practical applications.

Collaborations

Throughout his career, Kuo-Shu Kao has collaborated with notable professionals in the industry, including his coworkers Tao-Chih Chang and Wen-Chih Chen. These partnerships have been essential in fostering a collaborative environment that drives innovation and accelerates the development of new technologies in the semiconductor field.

Conclusion

Kuo-Shu Kao stands out as a visionary inventor in the realm of chip packaging and thermal management solutions. His continued pursuit of innovation and commitment to excellence has proven invaluable to the advancement of semiconductor technologies. With a solid portfolio of patents and a proven record of collaboration, he is well-positioned to lead future advancements in the industry.

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