The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
May. 17, 2013
Ngai Tsang, Tainan, TW;
Kuo-shu Kao, Hsinchu, TW;
Ngai Tsang, Tainan, TW;
Kuo-Shu Kao, Hsinchu, TW;
Taiwan TFT LCD Association, Hsinchu, TW;
Chunghwa Picture Tubes, LTD., Taoyuan, TW;
Au Optronics Corporation, Hsinchu, TW;
Hannstar Display Corporation, New Taipei, TW;
Innolux Corporation, Miao-Li County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A method of fabricating a circuit board is provided. An elastic bump material layer is formed on a substrate and then is patterned to form a plurality of first elastic bumps and a plurality of second elastic bumps, arranged in at least an array. A conductive layer is formed and then is patterned to form a patterned circuit layer to cover first plurality of elastic bumps and a portion of the substrate. An entirety of the plurality of second elastic bumps and another portion of the substrate are not covered by the patterned circuit layer. A protection layer is formed to cover a portion of the patterned circuit layer, a second number of the plurality of second elastic bumps entirely, a third number of the plurality of second elastic bumps partially and the another portion of the substrate, and expose the first number of the plurality of second elastic bumps.