For the Inventor, By the Inventor

Enter assignee name

Hsinchu, Taiwan

Asia Pacific Microsystems, Inc.

Calculating rank

USPTO Granted Patents = 19

% Expired Patents = 15.8

Forward Citations = 234

Loading Chart...

Loading Chart...

31 inventors (with patents filed for the assignee):

Chengkuo Lee (5 out of 6 patents)

Hung-Lin Yin (4 out of 4 patents)

Shih-Chin Gong (3 out of 18 patents)

4. Wen-Chih Chen (3 out of 18 patents)

5. Jerwei Hsieh (3 out of 4 patents)

6. Hung-Dar Wang (3 out of 4 patents)

7. Shu-Hui Tsai (3 out of 3 patents)

8. Jer-Wei Hsieh (2 out of 2 patents)

9. Chih-Chung Chen (2 out of 20 patents)

10. Yen-Jyh Lai (2 out of 2 patents)

11. Chung-Yang Tseng (2 out of 2 patents)

12. Chung-Hsien Lin (1 out of 59 patents)

13. Jer-Liang Andrew Yeh (1 out of 23 patents)

14. Yu-Che Huang (1 out of 3 patents)

15. Cheng-Yi Chiang (1 out of 1 patent)

19 patents: Sort by Forward Citations

1. 12402243 - Circuit carrier board (2025-08-26),

2. 10156489 - Piezoresistive pressure sensor (2018-12-18),

3. 9676609 - Integrated MEMS device (2017-06-13),

4. 9553055 - Method for fabricating semiconductor devices having reinforcing elements (2017-01-24),

5. 9459172 - Diaphragm piezoresistive pressure sensor (2016-10-04),

6. 9382113 - Method for fabricating a self-aligned vertical comb drive structure (2016-07-05),

7. 9359193 - Method for manufacturing an integrated MEMS device (2016-06-07),

8. 8916449 - Package structure and substrate bonding method (2014-12-23),

9. 7824945 - Method for making micro-electromechanical system devices (2010-11-02),

10. 6996306 - Electrostatically operated micro-optical devices and method for manufacturing thereof (2006-02-07),

11. 6967145 - Method of maintaining photolithographic precision alignment after wafer bonding process (2005-11-22),

12. 6924583 - Film bulk acoustic device with integrated tunable and trimmable device (2005-08-02),

13. 6901182 - Retro-reflective type optical signal processing device and method (2005-05-31),

14. 6864176 - Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method (2005-03-08),

15. 6859129 - Three-dimensional integrated adjustable inductor, its module and fabrication method of the same (2005-02-22),

Company Overview

Asia Pacific Microsystems, Inc. is a leading semiconductor company based in Hsinchu, Taiwan, specializing in the design and manufacturing of advanced microelectronic solutions. The company focuses on developing high-performance integrated circuits and system-on-chip (SoC) products tailored for various applications, including consumer electronics, telecommunications, and automotive systems. With a commitment to innovation, Asia Pacific Microsystems plays a significant role in the semiconductor industry, contributing to the advancement of technology across the Asia Pacific region.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

19 Patents

#173 in Hsinchu

#858 in Taiwan

#32,705 in the World

Hsinchu, Taiwan

Asia Pacific Microsystems, Inc.

Forward Citations = 234

31 inventors:

Chengkuo Lee (5 out of 6 patents)

Hung-Lin Yin (4 out of 4 patents)

Shih-Chin Gong (3 out of 18 patents)

4. Wen-Chih Chen (3 out of 18 patents)

5. Jerwei Hsieh (3 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Asia Pacific Microsystems, Inc.. Retrieved from https://idiyas.com/company/asia-pacific-microsystems

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…