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Hsinchu, Taiwan

Asia Pacific Microsystems, Inc.

USPTO Granted Patents = 19

% Expired Patents = 15.8

Forward Citations = 234

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31 inventors (with patents filed for the assignee):

Chengkuo Lee (5 out of 6 patents)

Hung-Lin Yin (4 out of 4 patents)

Shih-Chin Gong (3 out of 18 patents)

4. Wen-Chih Chen (3 out of 18 patents)

5. Jerwei Hsieh (3 out of 4 patents)

6. Hung-Dar Wang (3 out of 4 patents)

7. Shu-Hui Tsai (3 out of 3 patents)

8. Jer-Wei Hsieh (2 out of 2 patents)

9. Chih-Chung Chen (2 out of 20 patents)

10. Yen-Jyh Lai (2 out of 2 patents)

11. Chung-Yang Tseng (2 out of 2 patents)

12. Chung-Hsien Lin (1 out of 59 patents)

13. Jer-Liang Andrew Yeh (1 out of 23 patents)

14. Yu-Che Huang (1 out of 3 patents)

15. Cheng-Yi Chiang (1 out of 1 patent)

19 patents: Sort by Forward Citations

1. 12402243 - Circuit carrier board (2025-08-26),

2. 10156489 - Piezoresistive pressure sensor (2018-12-18),

3. 9676609 - Integrated MEMS device (2017-06-13),

4. 9553055 - Method for fabricating semiconductor devices having reinforcing elements (2017-01-24),

5. 9459172 - Diaphragm piezoresistive pressure sensor (2016-10-04),

6. 9382113 - Method for fabricating a self-aligned vertical comb drive structure (2016-07-05),

7. 9359193 - Method for manufacturing an integrated MEMS device (2016-06-07),

8. 8916449 - Package structure and substrate bonding method (2014-12-23),

9. 7824945 - Method for making micro-electromechanical system devices (2010-11-02),

10. 6996306 - Electrostatically operated micro-optical devices and method for manufacturing thereof (2006-02-07),

11. 6967145 - Method of maintaining photolithographic precision alignment after wafer bonding process (2005-11-22),

12. 6924583 - Film bulk acoustic device with integrated tunable and trimmable device (2005-08-02),

13. 6901182 - Retro-reflective type optical signal processing device and method (2005-05-31),

14. 6864176 - Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method (2005-03-08),

15. 6859129 - Three-dimensional integrated adjustable inductor, its module and fabrication method of the same (2005-02-22),

Asia Pacific Microsystems, Inc. is a leading semiconductor company based in Hsinchu, Taiwan, specializing in the design and manufacturing of advanced microelectronic solutions. The company focuses on developing high-performance integrated circuits and system-on-chip (SoC) products tailored for various applications, including consumer electronics, telecommunications, and automotive systems. With a commitment to innovation, Asia Pacific Microsystems plays a significant role in the semiconductor industry, contributing to the advancement of technology across the Asia Pacific region.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

19 Patents

#171 in Hsinchu

#853 in Taiwan

#32,623 in the World

Hsinchu, Taiwan

Asia Pacific Microsystems, Inc.

Forward Citations = 234

31 inventors:

Chengkuo Lee (5 out of 6 patents)

Hung-Lin Yin (4 out of 4 patents)

Shih-Chin Gong (3 out of 18 patents)

4. Wen-Chih Chen (3 out of 18 patents)

5. Jerwei Hsieh (3 out of 4 patents)

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