Jerwei Hsieh is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microelectromechanical systems (MEMS) with a total of four patents to his name. His work focuses on the integration of MEMS devices, which are crucial for various technological applications.

Latest Patents

Jerwei Hsieh's latest patents include an integrated MEMS device and a method for manufacturing such a device. The integrated MEMS device comprises a circuit chip and a device chip, featuring a patterned first bonding layer made of conductive materials. This innovative design allows for the creation of hermetic spaces that enhance the device's functionality. Additionally, his manufacturing method utilizes a sacrificial layer to integrate the MEMS wafer and the circuit wafer, ensuring that films on the circuit wafer remain undamaged during the process. This method allows for the use of stable structural materials, such as monocrystalline silicon and polysilicon, resulting in a high fill factor and planar top-surface topography.

Career Highlights

Throughout his career, Jerwei Hsieh has worked with notable organizations, including Asia Pacific Microsystems, Inc. and the Instrument Technology Research Center. His experience in these companies has contributed to his expertise in MEMS technology and device integration.

Collaborations

Jerwei has collaborated with several talented individuals in his field, including Hung-Lin Yin and Li-Yuan Lin. These collaborations have further enriched his work and led to advancements in MEMS technology.

Conclusion

Jerwei Hsieh's innovative contributions to the field of MEMS devices and his successful career highlight his importance as an inventor. His patents and collaborations reflect his commitment to advancing technology in meaningful ways.

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