Chung-Yang Tseng

Title: Innovations by Chung-Yang Tseng

Introduction

Chung-Yang Tseng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of photolithography and wafer bonding processes. With a total of two patents to his name, Tseng's work has advanced the precision and efficiency of semiconductor manufacturing.

Latest Patents

Tseng's latest patents include a method of maintaining photolithographic precision alignment after the wafer bonding process. This innovative method involves forming two cavities at the rear surface of a top wafer, corresponding to alignment marks on a bottom wafer. The depth of these cavities is designed to be deeper than that of the final membrane structure. After bonding the top wafer to the bottom wafer, which already has alignment marks and a microstructure, the bonded wafer undergoes annealing to enhance bonding strength. A thinning process is then applied, allowing the alignment marks to emerge in the top wafer cavities, serving as alignment marks for exposure equipment.

Another significant patent by Tseng is the fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method. This method involves fabricating thickness inspection patterns onto the silicon wafer substrate through anisotropic etching. After polishing the wafer, the desired thickness is achieved, and the thickness of the upper wafer is determined by the inspection patterns. This innovation is particularly applicable to MEMS micromachined devices that require precise wafer thickness.

Career Highlights

Chung-Yang Tseng is currently employed at Asia Pacific Microsystems, Inc., where he continues to develop cutting-edge technologies in semiconductor manufacturing. His expertise in photolithography and wafer bonding has positioned him as a key figure in the industry.

Collaborations

Tseng has collaborated with notable colleagues, including Shih-Chin Gong and Hung-Dar Wang. These partnerships have fostered innovation and contributed to the advancement of their shared field.

Conclusion

Chung-Yang Tseng's contributions to the semiconductor industry through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the field of photolithography and wafer bonding processes, showcasing the importance of innovation in modern manufacturing.