Jer-Wei Hsieh

Title: Jer-Wei Hsieh: Innovator in Circuit Carrier Technology

Introduction

Jer-Wei Hsieh is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of circuit carrier technology, holding a total of 2 patents. His work focuses on innovative designs that enhance the functionality and efficiency of electronic components.

Latest Patents

One of Jer-Wei Hsieh's latest patents is for a Circuit Carrier Board. This invention includes a substrate with a first and second surface, along with a substrate hole that penetrates both surfaces. The design features a magnet sheath that covers the hole boundary, incorporating a first and second magnetic surface. Additionally, it includes dielectric isolation layers and a conductive metal layer that enhances the overall performance of the carrier board.

Another notable patent is a Method for Fabricating a Self-Aligned Vertical Comb Drive Structure. This method involves creating a multi-layer structure with inter-digitated comb structures formed through etching. The process allows for precise alignment and fabrication of comb fingers, which are essential for various applications in microelectromechanical systems (MEMS).

Career Highlights

Jer-Wei Hsieh is currently employed at Asia Pacific Microsystems, Inc., where he continues to innovate and develop advanced technologies. His expertise in circuit design and fabrication has positioned him as a key player in the industry.

Collaborations

Throughout his career, Jer-Wei Hsieh has collaborated with talented individuals such as Han-Tang Su and Hung-Lin Yin. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Jer-Wei Hsieh's contributions to circuit carrier technology and his innovative patents demonstrate his commitment to advancing the field. His work continues to influence the development of electronic components, making him a notable figure in the industry.