The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Apr. 24, 2009
Wen-chih Chen, Hsin Chu Hsien, TW;
Sheng-shu Yang, Hsin Chu, TW;
Wen-Chih Chen, Hsin Chu Hsien, TW;
Sheng-Shu Yang, Hsin Chu, TW;
Taiwan TFT LCD Association, Hsinchu, TW;
Chunghwa Picture Tubes, Ltd., Taoyuan, TW;
Au Optronics Corp., Hsinchu, TW;
Hannstar Display Corp., Taipei, TW;
Chi Mei Optoelectronics Corp., Tainan County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Toppoly Optoelectronics Corp., Miao-Li County, TW;
Quanta Display Inc., Tao Yuan Shien, TW;
Abstract
A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.