The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Jan. 08, 2020
Icp Technology Co., Ltd., Taoyuan, TW;
Industrial Technology Research Institute, Hsinchu, (Taiwan), Hsinchu, TW;
Ho-Chieh Yu, Taoyuan, TW;
Chen-Cheng-Lung Liao, Taoyuan, TW;
Chun-Yu Lin, Taoyuan, TW;
Hsiao-Ming Chang, New Taipei, TW;
Jing-Yao Chang, Hsinchu, TW;
Tao-Chih Chang, Hsinchu, TW;
ICP Technology Co., Ltd., Taoyuan, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A ceramic substrate component suitable for high-power chips includes a ceramic substrate body and at least one raised metal pad. The ceramic substrate body has an upper surface and a lower surface opposite to the upper surface. The raised metal pad includes a base portion and a top layer. The base portion, which is attached to the upper surface of the ceramic substrate body, has a thickness between 10 and 300 micrometers, and a thermal expansion coefficient greater than the ceramic substrate body. The top layer is formed on the base portion and adapted to install a high-power chip thereon. The top layer extends an area less than the base portion but greater than the high-power chip, and has a thermal expansion coefficient greater than the ceramic substrate body. As such, damages due to thermal stress occurring between the base portion and the ceramic substrate body can be mitigated.