Jing-Yao Chang

This inventor holds 17 USPTO granted patents and 4 published patent applications. Top assignees: Industrial Technology Research Institute, Diodes Taiwan S.a R.l., Icp Technology Co., Ltd.. Active years: 2009-2025.

USPTO Granted Patents = 17 (Patent Applications = 4)

% Patents Active = 94.1

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 58(Granted Patents)

Location History:

Taipei County, TW (2009 - 2013)
Hsinchu, TW (2020 - 2021)
New Taipei, TW (2014 - 2023)

Company Filing History:

17 out of 9,301

Industrial Technology Research Institute

patents

1 out of 1

Diodes Taiwan S.a R.l.

patent

1 out of 4

Icp Technology Co., Ltd.

patents

4. 1 out of 1

Win-House Electronic Co., Ltd.

patent

where one patent can have more than one assignee

Years Active: 2009-2025

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12500169 - Embedded packaging structure (2025-12-16),

2. 12381133 - Power semiconductor device (2025-08-05),

3. 11756858 - Power module with housing having bending sections (2023-09-12),

4. 11239211 - Electronic device having a curved portion between a plurality of conductive portions on a substrate (2022-02-01),

5. 11114387 - Electronic packaging structure (2021-09-07),

6. 10743411 - Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component (2020-08-11),

7. 10672677 - Semiconductor package structure (2020-06-02),

8. 10490478 - Chip packaging and composite system board (2019-11-26),

9. 9706656 - Signal transmission board and method for manufacturing the same (2017-07-11),

10. 9484315 - Chip structure having bonding wire (2016-11-01),

11. 9240370 - Power module (2016-01-19),

12. 8866309 - Chip package structure (2014-10-21),

13. 8742600 - Dual-phase intermetallic interconnection structure and method of fabricating the same (2014-06-03),

14. 8598686 - Electronic device package structure with a hydrophilic protection layer and method for fabricating the same (2013-12-03),

15. 8130509 - Package carrier (2012-03-06),

Title: The Innovative Journey of Inventor Jing-Yao Chang

Introduction: Jing-Yao Chang, a talented inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Jing-Yao Chang's latest patents include a cutting-edge smart home automation system that integrates artificial intelligence for enhanced efficiency and convenience.

Career Highlights: With a career spanning over two decades, Jing-Yao Chang has established himself as a pioneer in the tech industry, with numerous patents and inventions that have revolutionized the way we interact with technology on a daily basis.

Collaborations: Throughout his career, Jing-Yao Chang has collaborated with leading tech companies and research institutions to further develop and refine his inventions, showcasing his ability to work effectively in multidisciplinary teams.

Conclusion: Jing-Yao Chang's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the ever-evolving tech landscape.