The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2013
Filed:
Sep. 27, 2010
Tao-chih Chang, Taoyuan County, TW;
Su-tsai LU, Hsinchu, TW;
Jing-yao Chang, Taipei County, TW;
Chau-jie Zhan, Taipei County, TW;
Tao-Chih Chang, Taoyuan County, TW;
Su-Tsai Lu, Hsinchu, TW;
Jing-Yao Chang, Taipei County, TW;
Chau-Jie Zhan, Taipei County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
The invention provides an electronic device package structure and method of fabrication thereof. The electronic device package structure includes a chip having an active surface and a bottom surface. A dielectric layer is disposed on the active surface of the chip. At least one trench is formed through the dielectric layer. A first protection layer covers the dielectric layer and sidewalls of the trench. A second protection layer covers the first protection layer, filling the trench.