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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12500169 B1

PDFFull Text
Date of Patent:
Dec. 16, 2025

Filed:

Dec. 27, 2021

Embedded packaging structure

Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Jing-Yao Chang, New Taipei, TW;

Yu Chih Wang, Taipei, TW;

Assignee:

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;

Attorney:

Maschoff Brennan

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 23/5283 (2013.01); H01L 24/32 (2013.01); H01L 21/76802 (2013.01); H01L 21/76873 (2013.01); H01L 23/481 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract

An embedded packaging structure includes a die, a sintered metal layer, an encapsulation layer and a conductive via. The die includes a metallic bonding layer. Sintered metal layer is bonded to the metallic bonding layer. The encapsulation layer covers the die. The conductive via is provided in a blind hole of the encapsulation layer, and the conductive via is electrically connected with the metallic bonding layer through the sintered metal layer.

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Chang, Jing-Yao. (2025). Embedded packaging structure (U.S. Patent No. 12500169). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12500169

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