The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2008
Filed:
Aug. 02, 2005
Fang-jun Leu, Hsinchu, TW;
Shou-lung Chen, Yangmei Township, Taoyuan County, TW;
Ching-wen Hsiao, Banciao, TW;
Shan-pu Yu, Chiayi, TW;
Jyh-rong Lin, Tucheng, TW;
I-hsuan Peng, Jhudong Township, Hsinchu County, TW;
Jian-shu Wu, Peikang Township, Yunlin County, TW;
Hui-mei Wu, Jhudong Township, Hsinchu County, TW;
Chien-wei Chieh, Wujie Township, Yilan County, TW;
Fang-Jun Leu, Hsinchu, TW;
Shou-Lung Chen, Yangmei Township, Taoyuan County, TW;
Ching-Wen Hsiao, Banciao, TW;
Shan-Pu Yu, Chiayi, TW;
Jyh-Rong Lin, Tucheng, TW;
I-Hsuan Peng, Jhudong Township, Hsinchu County, TW;
Jian-Shu Wu, Peikang Township, Yunlin County, TW;
Hui-Mei Wu, Jhudong Township, Hsinchu County, TW;
Chien-Wei Chieh, Wujie Township, Yilan County, TW;
Industrial Technology Research Institute, Chutung, Hsinchu, TW;
Abstract
This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.