The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Feb. 22, 2013
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Chi-Shih Chang, Hsinchu, TW;
Ra-Min Tain, Hsinchu, TW;
Shyi-Ching Liau, Hsinchu, TW;
Wei-Chung Lo, Hsinchu, TW;
Rong-Shen Lee, Hsinchu, TW;
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/60 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/562 (2013.01); H01L 24/94 (2013.01); H01L 23/552 (2013.01); H01L 23/60 (2013.01); H01L 23/642 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01033 (2013.01);
Abstract
A wafer stack includes: a first wafer having a first substrate and a first device layer having therein at least a chip; a second wafer having a second substrate disposed above the first wafer; and at least a first metal post existing in the first device layer, and arranged between the first and the second substrates, without being electrically connected to the chip.