Location History:
- Junghe, TW (2005 - 2008)
- Zhonghe, TW (2011)
- Taipei County, TW (2011 - 2012)
- Hsinchu, TW (2011 - 2018)
- Taipei, TW (2013 - 2023)
- New Taipei, TW (2022 - 2023)
Company Filing History:
21 out of 9,138 
5 out of 497 
2 out of 1,195 Years Active: 2005-2023
Title: Wei-Chung Lo: A Pioneer in Package Substrate Innovations
Introduction
Wei-Chung Lo is a prominent inventor based in Taipei, Taiwan, known for his significant contributions to the field of package substrate technology. With a remarkable portfolio of 23 patents, Lo has established himself as a leader in innovation, particularly in the realm of electronic packaging.
Latest Patents
Among his latest inventions are two notable patents focusing on advanced package substrates and chip package structures. The first patent describes a package substrate that comprises a substrate with a first and a second surface, an insulating protective layer, and an interposer. This design introduces a plurality of first conductive pads embedded in the substrate's first surface, surrounded by an insulating protective layer with an opening to expose those pads. The interposer, strategically placed, includes conductive vias and second conductive pads that ensure electrical connectivity between components.
The second patent reiterates and expands upon the concepts of the first, detailing an innovative method of fabricating package substrates. This invention highlights the importance of the insulating protective layer and its engagement with the interposer, enhancing the efficiency and reliability of electronic assemblies.
Career Highlights
Wei-Chung Lo has enjoyed a successful career, including significant tenures at renowned organizations such as the Industrial Technology Research Institute and Unimicron Technology Corporation. Through his work, he has continually pushed the boundaries of technology in electronic packaging, making substantial contributions to the industry.
Collaborations
Lo has collaborated with esteemed professionals in the field, including his coworkers Yu-Hua Chen and Ra-Min Tain. Their collective efforts have resulted in groundbreaking developments in package substrates, contributing to enhanced performance and functionality in various applications.
Conclusion
Wei-Chung Lo's innovative spirit and dedication to advancing technology have solidified his status as a key figure in the field of package substrates. With 23 patents to his name, his work continues to influence the landscape of electronic packaging, setting new standards for the industry and inspiring future inventors.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.