The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Jul. 17, 2018
Industrial Technology Research Institute, Hsinchu, TW;
Unimicron Technology Corp., Taoyuan, TW;
Yu-Hua Chen, Nantou County, TW;
Wei-Chung Lo, Taipei, TW;
Dyi-Chung Hu, Taoyuan, TW;
Chang-Hong Hsieh, Taoyuan, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a first surface including a plurality of conductive pads and a second surface; an insulating protective layer formed on the first surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and at least a passive component provided on the first surface of the substrate. The insulating protective layer includes at least an opening for exposing at least one of the conductive pads, and the at least the passive component is directly provided on the conductive pad exposed from the opening.