Chang-Hong Hsieh

Title: Chang-Hong Hsieh: Innovator in Package Substrate Technology

Introduction

Chang-Hong Hsieh is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of package substrate technology, holding a total of 4 patents. His innovative work has advanced the design and fabrication of electronic components, making them more efficient and reliable.

Latest Patents

One of his latest patents is titled "Package substrate and method of fabricating the same." This invention describes a package substrate that includes a substrate, an interposer, and an insulating protective layer. The substrate features a first surface and a second surface opposing the first surface, with the first surface containing a plurality of first conductive pads. The interposer is strategically placed on the first surface, partially covering the conductive pads, and includes penetrating conductive vias that are electrically connected to the substrate. The insulating protective layer surrounds the interposer and contains at least one penetrating conductive column, which has a greater width than the vias of the interposer.

Another notable patent is also titled "Package substrate and method of fabricating the same." This invention outlines a package substrate that consists of a substrate with conductive pads on its first surface and an insulating protective layer formed on top. An interposer is embedded within the insulating layer, and at least one passive component is placed directly on the exposed conductive pad. The insulating layer features openings that allow access to the conductive pads, enhancing the functionality of the package substrate.

Career Highlights

Chang-Hong Hsieh has worked with several esteemed organizations throughout his career. He has been associated with the Industrial Technology Research Institute, where he contributed to various research projects. Additionally, he has worked at Unimicron Technology Corporation, furthering his expertise in the field of electronic packaging.

Collaborations

Throughout his career, Chang-Hong Hsieh has collaborated with notable colleagues, including Yu-Hua Chen and Wei-Chung Lo. These collaborations have fostered innovation and have led to advancements in package substrate technology.

Conclusion

Chang-Hong Hsieh is a distinguished inventor whose work in package substrate technology has made a significant impact on the electronics industry. His patents reflect his commitment to innovation and excellence in design. His contributions continue to influence the development of more efficient electronic components.