The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
May. 06, 2010
Applicants:
Kuan-neng Chen, Taipei County, TW;
Wei-chung Lo, Taipei, TW;
Cheng-ta Ko, Hsinchu, TW;
Inventors:
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B32B 9/04 (2006.01); B32B 7/04 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 27/28 (2006.01); B32B 3/08 (2006.01);
U.S. Cl.
CPC ...
B32B 9/04 (2013.01); B32B 3/08 (2013.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 9/00 (2013.01); B32B 15/01 (2013.01); B32B 27/283 (2013.01); B32B 2307/714 (2013.01); Y10T 156/10 (2015.01); Y10T 428/12771 (2015.01); Y10T 428/31678 (2015.04);
Abstract
A bonding structure and a method of fabricating the same are provided. A first substrate having a first bonding element and a second substrate having a second bonding element are provided, wherein at least one of the first bonding element and the second bonding element is formed with an alloy. A bonding process is performed to bond the first bonding element with the second bonding element, wherein a diffusion liner is generated at the exposed, non-bonded surface of the bonding structure.