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For the Inventor, By the Inventor

Hsinchu, Taiwan

Rong-Shen Lee

USPTO Granted Patents = 12 

Average Co-Inventor Count = 3.9

ph-index = 7

Forward Citations = 497(Granted Patents)


Location History:

  • Chupei, TW (2002)
  • Hsinchu County, TW (2011 - 2012)
  • Hsinchu, TW (1999 - 2015)

Company Filing History:

goldMedal12 out of 9,138 
 
Industrial Technology Research Institute
 patents

Years Active: 1999-2015

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12 patents (USPTO):
1. 9111774 - Wafer-to-wafer stack with supporting post (2015-08-18),
2. 8810031 - Wafer-to-wafer stack with supporting pedestal (2014-08-19),
3. 8280081 - Electrode connection structure of speaker unit (2012-10-02),
4. 8243966 - Assembly structure of a flat speaker (2012-08-14),
5. 8164165 - Wafer-to-wafer stack with supporting pedestal (2012-04-24),
6. 7948072 - Wafer-to-wafer stacking (2011-05-24),
7. 6590282 - Stacked semiconductor package formed on a substrate and method for fabrication (2003-07-08),
8. 6536653 - One-step bumping/bonding method for forming semiconductor packages (2003-03-25),
9. 6479321 - One-step semiconductor stack packaging method (2002-11-12),
10. 6459150 - Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer (2002-10-01),
11. 6166435 - Flip-chip ball grid array package with a heat slug (2000-12-26),
12. 5977626 - Thermally and electrically enhanced PBGA package (1999-11-02),

Title: The Innovative Mind of Rong-Shen Lee

Introduction: Rong-Shen Lee is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of electronic device technology. With a remarkable total of 12 patents to his name, Lee has established himself as a key figure in the industry, particularly through his innovative approaches to wafer stacking technology.

Latest Patents: Among his latest patents are two notable inventions that enhance electronic device structures. The first is the "Wafer-to-wafer stack with supporting post," which features a unique arrangement of a first wafer with a substrate and a device layer housing a chip, complemented by a second wafer and a first metal post situated within the first device layer. This design ensures that the metal post remains unconnected to the chip, paving the way for improved device integrity. The second patent, titled "Wafer-to-wafer stack with supporting pedestal," describes an electronic device that incorporates a stacked structure made up of a first electronic layer and a second layer. This invention involves an intricate post structure extending from a first interface to the surface of the first device layer, further enhancing the design's functionality.

Career Highlights: Rong-Shen Lee is currently associated with the Industrial Technology Research Institute, where he applies his expertise to advanced research and development in electronics. His innovative work in wafer technologies exemplifies his commitment to pushing the boundaries of what is possible in electronic devices.

Collaborations: Throughout his career, Lee has collaborated with notable colleagues, including Hsing-Seng Wang and Chi-Shih Chang. Their combined efforts have contributed to numerous groundbreaking developments in the field, demonstrating the power of teamwork in innovation.

Conclusion: Rong-Shen Lee stands out as an influential inventor whose work in wafer stacking technology is shaping the future of electronic devices. With a solid portfolio of patents and a collaborative spirit, he continues to drive forward advancements in technology, inspiring the next generation of inventors.

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