Industrial Technology Research Institute

Rong-Shen Lee

Ra-Min Tain

Wei-Chung Lo

Shyi-Ching Liau

Chi-Shih Chang

Hsing-Seng Wang

Yu-Min Lin

Ming-Daw Chen

Chang-Ho Liou

Yu-Wei Huang

Hsin-Chien Huang

Chiang-Han Day

Chia-Chung Wang

Shu-Ming Chang

Fang-Jun Leu

Enboa Wu

Tsung-Yao Chu

Randy Hsiao-Yu Lo

Pou-Huang Chen

A wafer stack includes: a first wafer having a first substrate and a first device layer having therein at least a chip; a second wafer having a second substrate disposed above the first wafer; and at least a first metal post existing in the first device layer, and arranged between the first and the second substrates, without being electrically connected to the chip.

Wafer-to-wafer stack with supporting post

An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer.

Wafer-to-wafer stack with supporting pedestal

An electrode connection structure of a speaker unit is provided. The speaker unit includes at least one electrode layer, which is made of a conductive material, or made of a non-conductive material with a conductive layer formed on a surface thereof. The electrode connection structure includes a conductive electrode and an adhesive material. The conductive electrode is used for providing power supply signals for the speaker unit to generate sounds. The adhesive material adheres the conductive electrode in parallel with a surface of the electrode layer. The adhesive material has adhesive characteristics, so as to electrically connect the conductive electrode and the electrode layer, in which the adhesive material is adhered to a side of the surface of the electrode layer closely adjacent to the conductive electrode with a certain area.

Electrode connection structure of speaker unit

An assembly structure of flat speaker including at least two speaker units and one connecting structure is provided. Each speaker unit includes a first electrode, a vibrating film, and a second electrode. The connecting structure includes two conductive layers, and a first insulating layer. A first conductive layer is connected the first electrode through a contact area, and each has a first length and a third length parallel to the contact area. A second conductive layer is connected the second electrode through a contact area, and each has a second length and a fourth, a fifth length parallel to the contact area. The third length is less than or equal to a sum of the first lengths of the speaker units. A sum of the third, the fourth, and the fifth length is less than or equal to a sum of the first and second lengths.

Assembly structure of a flat speaker

A novel three dimensional wafer stack and the manufacturing method therefor are provided. The three dimensional wafer stack includes a first wafer having a first substrate and a first device layer having thereon at least one chip, a second wafer disposed above the first wafer and having a second substrate, and at least one pedestal arranged between and extending from the first substrate to the second substrate. The pedestal arranged in the device layer is used for preventing the low-k materials existing in the device layer from being damaged by the stresses.

A wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate.

Wafer-to-wafer stacking

A stacked semiconductor package formed on a substrate arranged in a serpentine configuration and a method for such fabrication are disclosed. The package is formed by at least one substrate section formed on the substrate bonded to at least one IC die by a flip-chip bonding method. The substrate is then folded onto itself such that the backside of a first IC die is adhesively bonded to the backside of a second IC die. A heat sink may optionally be utilized in-between the IC dies during the adhesive bonding process to further enhance thermal dissipation. The substrate section may be bonded to a printed circuit board by a plurality of solder balls formed on an active surface of the substrate section. The present invention can be bonded to a printed circuit board either in a horizontal position or in a vertical position for saving more real-estate on the board.

Stacked semiconductor package formed on a substrate and method for fabrication

A one-step bumping/bonding process for forming a semiconductor package is disclosed. In the method, a first electronic substrate which has either a plurality of conductive pads or a plurality of recessed openings formed on top of a plurality of apertures through the substrate is first provided and aligned with a second electronic substrate that has a plurality of conductive pads with each aperture aligned to a conductive pad on the second substrate. A plurality of solder balls is then planted on top of the plurality of conductive pads or the plurality of recessed openings on the surface of the first electronic substrate by a pick-and-place technique. Alternatively, a plurality of solder paste may be printed by a thick film stencil printing process similarly in place of the plurality of solder balls. After a solder reflow process, the solder balls placed on top of the apertures is reflown into the apertures forming solder plugs and making electrical connection with the conductive pads on the second electronic substrate thus completing the one-step bumping/bonding process for forming a semiconductor package. The electronic substrate may be either a printed circuit board or a silicon wafer.

One-step bumping/bonding method for forming semiconductor packages

The present invention discloses a method that applies one time of reflow after stacking a plurality of semiconductor elements to complete the packaging. The upper surface of the chip carrier substrate (opposite side to the chip) in a semiconductor packaging element is implanted with solder balls or coated with solder paste. After stacking a plurality of the semiconductor packaging elements together, a reflow is applied to achieve electrical and physical connections among substrates. If the semiconductor packaging elements are ultra-thin elements, then one only needs to implant solder balls or coat solder paste on the substrate top surface of the top semiconductor packaging element and the substrate bottom surface of the bottom semiconductor packaging element. The reflow will make the soldering material permeate through each layer of substrate, completing the electrical connection between substrates. This type of one-step stack packaging can simultaneously satisfy the requirements of high packaging densities, simple manufacturing processes and low costs.

One-step semiconductor stack packaging method

A single-step bumping/bonding method for forming a semiconductor package of two electronic substrates electrically connected together by solder bumps. In the method, a first electronic substrate is provided equipped with a first plurality of conductive pads formed in an insulating material layer, the plurality of conductive pads each having an aperture formed therethrough for receiving a solder material when the first electronic substrate is positioned juxtaposed to a second electronic substrate equipped with a second plurality of conductive pads such that solder bumps may be formed bonding the first plurality of conductive pads to the second plurality of conductive pads. One of the two electronic substrates may be a silicon wafer, while the other may be a printed circuit board or a silicon wafer.

Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer

An extended flip chip ball grid array package includes a metal heat slug bonded to the surface of a semiconductor chip. The heat slug has a bonding structure for connecting itself and a BGA substrate panel on which the semiconductor chip is mounted. The heat slug protects the chip from being damaged as well as assists heat dissipation. A first package assembly provides contact bodies on the heat slug for bonding the heat slug to contact pads formed on a BGA substrate panel. A second package assembly fixes the heat slug to a supporting structure bonded on a BGA substrate panel. Supporting stubs are formed on the supporting structure and snapped in openings formed on the contact bodies of the heat slug. Conventional packaging or testing equipment can be used for both package assemblies to manufacture or test the semiconductor chip packages.

Flip-chip ball grid array package with a heat slug

The present invention includes a substrate having a die adhered thereon. The die and the substrate are interconnected by means of signal transferring means. Solder bumps are formed on the bottom side surface of the substrate. Molding compound is encapsulated among the substrate, the die and a heat spreader. A heat spreader is arranged over the top surface of the substrate. The heat spreader includes a plane having four supporting members that are set on the bottom side of the plane and at the corners of the plane. The supporting members are protruded from the plane to connect the heat spreaders and the substrate. The heat spreader further includes a protruded portion. A further supporting member is formed on the central portion of the protruded portion. The substrate has a die paddle formed thereon for receiving the die. A power ring is formed around the die paddle on the surface of the substrate for power input. A ground ring formed around the power ring on the substrate has ground pads. The supporting members of the heat spreader are connected on the ground pads by using the heat spreader attach material.

Growing community of inventors

Hsinchu, Taiwan

Rong-Shen Lee