Muh-Min Yih

Title: Innovations of Muh-Min Yih in Wafer-Level Packaging

Introduction

Muh-Min Yih is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative approaches to wafer-level packaging processes. His work has implications for the efficiency and effectiveness of electronic device manufacturing.

Latest Patents

Muh-Min Yih holds a patent for a wafer-level packaging process. This process involves several intricate steps, including the formation of a patterned photoresist on a wafer, the creation of a stress buffer layer, and the definition of openings that facilitate the filling of solder material. The method allows for the direct connection of the packaged wafer onto an external carrier after dicing, showcasing a streamlined approach to semiconductor packaging.

Career Highlights

Yih is currently associated with Apack Technologies Inc., where he continues to develop and refine innovative packaging solutions. His expertise in wafer-level packaging has positioned him as a key figure in advancing semiconductor technology.

Collaborations

(Section skipped due to space constraints.)

Conclusion

Muh-Min Yih's contributions to wafer-level packaging represent a significant advancement in semiconductor technology. His innovative processes enhance the efficiency of electronic device manufacturing and demonstrate the importance of continued research and development in this field.