Company Filing History:
Years Active: 2002
Title: Innovations by Hung Hsiang Lee in Solder Screen Printing Process
Introduction
Hung Hsiang Lee is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative solder screen printing process. His work has implications for the efficiency and effectiveness of chip production.
Latest Patents
Hung Hsiang Lee holds a patent for a solder screen printing process. This process involves several steps, including providing a wafer with multiple chips and a passivation layer that covers the chips while exposing bonding pads. The bonding pads are equipped with under bump metal (UBM) structures. The process also includes forming a pattern layer on the wafer, which defines the locations for bump formation. The wafer is then mounted on a carrier, and the first openings are filled with solder paste. This innovative approach enhances the manufacturing process of semiconductor devices.
Career Highlights
Hung Hsiang Lee is currently associated with Apack Technologies Inc., where he continues to develop and refine his inventions. His expertise in solder screen printing has positioned him as a valuable asset in the semiconductor industry. His contributions are recognized for their potential to improve production techniques and product quality.
Conclusion
Hung Hsiang Lee's work in the solder screen printing process exemplifies innovation in semiconductor manufacturing. His patent reflects a commitment to advancing technology in this critical field.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.