Apack Technologies Inc.

Hung Hsiang Lee

A solder screen printing process comprises: providing a wafer having a plurality of chips thereon, and a passivation layer covering the chips while exposing a plurality of bonding pads of the chips, wherein the bonding pads have a plurality of under bump metal (UBM) structures formed thereon; forming a pattern layer on the wafer, wherein the pattern layer has a plurality of first openings that defines the locations on the chips where bumps are to be subsequently formed; providing a carrier that has a wafer mounting location, providing a mounting support means that is mounted on the carrier, wherein the mounting support means has a second opening of the wafer size, such that the wafer mounting location of the carrier is exposed through the second opening; mounting the wafer on the carrier through the second opening of the mounting support means; and filling the first openings with a solder paste.

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Hsinchu County, Taiwan

Hung Hsiang Lee