The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2002
Filed:
Mar. 07, 2001
Hung Hsiang Lee, Hsinchu County, TW;
Apack Technologies Inc., Hsicnhu, TW;
Abstract
A solder screen printing process comprises: providing a wafer having a plurality of chips thereon, and a passivation layer covering the chips while exposing a plurality of bonding pads of the chips, wherein the bonding pads have a plurality of under bump metal (UBM) structures formed thereon; forming a pattern layer on the wafer, wherein the pattern layer has a plurality of first openings that defines the locations on the chips where bumps are to be subsequently formed; providing a carrier that has a wafer mounting location, providing a mounting support means that is mounted on the carrier, wherein the mounting support means has a second opening of the wafer size, such that the wafer mounting location of the carrier is exposed through the second opening; mounting the wafer on the carrier through the second opening of the mounting support means; and filling the first openings with a solder paste.