Taipei, Taiwan

Jin-Chyuan Biar


Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Taipei, TW (2001)
  • Taipei Hsien, TW (2001)

Company Filing History:


Years Active: 2001

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Jin-Chyuan Biar

Introduction

Jin-Chyuan Biar is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging and reliability processes. With a total of 2 patents, his work has advanced the efficiency and effectiveness of chip assembly methods.

Latest Patents

One of Jin-Chyuan Biar's latest patents is a method for improving the reliability of the underfill process for a chip. This innovative approach involves generating a hole in a substrate, where a chip is connected using flip chip assembly. The hole is aligned with the chip receiving area, allowing for an underfill process that encapsulates the space between the chip and substrate with liquid encapsulated material. The material is injected from the back side of the substrate to the front side, enhancing the reliability of the connection.

Another significant patent is a chip scale packaging method. This method packages a single-sided substrate along with one or more semiconductor chips. The nonconductive surface of the substrate is equipped with chip-implanting adhesive areas, which are stenciled and provided with through holes. The chips are implanted in these adhesive areas, ensuring that the active surfaces are in contact with the adhesive. After implantation, the substrate and chips are heated under pressure, allowing for the bonding pads to connect with the conductive surface through metal bonding wires. This process is completed with a passivation layer and a grid array of spherical bonding points.

Career Highlights

Throughout his career, Jin-Chyuan Biar has worked with several companies, including United Test Center Inc. and Apack Technologies Inc. His experience in these organizations has contributed to his expertise in semiconductor technologies and patent development.

Collaborations

Jin-Chyuan has collaborated with notable coworkers such as Chong-Ren Maa and Cheng-Hui Lee. Their combined efforts have fostered innovation in the semiconductor field.

Conclusion

Jin-Chyuan Biar's contributions to semiconductor technology through his patents and career achievements highlight his role as an influential inventor. His innovative methods continue to shape the industry and improve chip assembly processes.

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