Sam Chiang

Title: Innovations by Sam Chiang in Integrated Circuit Packaging

Introduction

Sam Chiang is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique packaging method that enhances the performance and efficiency of integrated circuit devices.

Latest Patents

Sam Chiang holds a patent for a "Flip clip bonding leadframe-type packaging method for integrated circuit device." This method is designed to apply flip chip bonding techniques to leadframe-type chip carriers. The packaging method simplifies the assembly of integrated circuit chips with leadframes, ensuring that the chips are assembled correctly without false soldering. Additionally, this method reduces the inductance of the transmission line, resulting in faster transmission speeds. Importantly, the cost of this packaging method is significantly lower than that of organic or ceramic base boards.

Career Highlights

Sam Chiang is currently employed at Apack Technologies Inc., where he continues to innovate in the field of integrated circuit packaging. His work has been instrumental in advancing the technology used in electronic devices. With a focus on efficiency and cost-effectiveness, he has positioned himself as a key player in the industry.

Collaborations

Sam has collaborated with talented individuals such as Albert Lin and Chong-Ren Maa. Their combined expertise has contributed to the successful development of innovative solutions in integrated circuit technology.

Conclusion

Sam Chiang's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence. His patented methods not only improve performance but also reduce costs, making a significant impact in the electronics industry.