Company Filing History:
Years Active: 2002
Title: Innovations by Tung-Liang Shao in Wafer-Level Packaging
Introduction
Tung-Liang Shao is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative work in wafer-level packaging processes. His expertise and inventions have paved the way for advancements in the electronics industry.
Latest Patents
Tung-Liang Shao holds a patent for a wafer-level packaging process. This patent describes a method involving a wafer that has multiple bonding pads exposed through a passivation layer. An under bump metal (UBM) is formed on each bonding pad, and a stress buffer layer is created with openings that expose the UBM. Solder material is filled into these openings, and a stencil or patterned photoresist is used to arrange additional openings for further solder application. The solder material is then reflowed, completing the packaging process.
Career Highlights
Tung-Liang Shao is currently associated with Apack Technologies Inc., where he continues to innovate and develop new technologies in semiconductor packaging. His work has been instrumental in enhancing the efficiency and reliability of electronic devices.
Conclusion
Tung-Liang Shao's contributions to wafer-level packaging represent a significant advancement in semiconductor technology. His innovative approach and dedication to his field continue to influence the electronics industry positively.
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