The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2007
Filed:
Dec. 22, 2004
Applicant:
Cheng-lien Chiang, Taipei, TW;
Inventor:
Cheng-Lien Chiang, Taipei, TW;
Assignee:
Bridge Semiconductor Corporation, Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/28 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on opposite sides of the lead, and the wire bonds contact the same side of the lead.