The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Jan. 16, 2018
Applicant:
Bridge Semiconductor Corp., Taipei, TW;
Inventors:
Charles W. C. Lin, Singapore, SG;
Chia-Chung Wang, Hsinchu County, TW;
Assignee:
BRIDGE SEMICONDUCTOR CORP., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 21/4803 (2013.01); H01L 21/4828 (2013.01); H01L 21/4846 (2013.01); H01L 23/3185 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/1715 (2013.01); H01L 2924/182 (2013.01);
Abstract
The wiring substrate includes a cavity and a plurality of metal leads disposed around the cavity. The metal leads are bonded with a resin compound and provide horizontal and vertical routing for a semiconductor device to be disposed in the cavity. The resin compound fills in spaces between the metal leads and surrounds the cavity and provides a dielectric platform for a re-distribution layer or a build-up circuitry optionally deposited thereon.