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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chia Chung Wang

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Bridge Semiconductor Corporation. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia Chung Wang. Retrieved from https://idiyas.com/inventor/chia-chung-wang-u9u5c1kg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal2 out of 166 
 
Bridge Semiconductor Corporation
 patents

Years Active: 2014

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2 patents (USPTO):Explore Patents
1. 8901435 - Hybrid wiring board with built-in stopper, interposer and build-up circuitry (2014-12-02),
2. 8865525 - Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby (2014-10-21),

Title: Chia Chung Wang - Innovative Inventor from Hsinchu

Introduction: Chia Chung Wang is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Wang's latest patents include advancements in semiconductor technology, renewable energy systems, and artificial intelligence applications, showcasing his diverse range of expertise.

Career Highlights: With over two decades of experience in research and development, Wang has held key positions in leading tech companies, driving forward cutting-edge projects and spearheading innovative solutions.

Collaborations: Wang has collaborated with top research institutions and universities worldwide, fostering a culture of knowledge exchange and pushing the boundaries of technological advancements.

Conclusion: Chia Chung Wang's relentless pursuit of innovation and his passion for creating impactful solutions have solidified his position as a trailblazing inventor in the global tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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