The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Jun. 26, 2012
Charles W. C. Lin, Singapore, SG;
Chia Chung Wang, Hsinchu, TW;
Charles W. C. Lin, Singapore, SG;
Chia Chung Wang, Hsinchu, TW;
Bridge Semiconductor Corporation, Taipei, TW;
Abstract
A method of making a cavity substrate. The method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier, an adhesive and an electrical pad, wherein the adhesive bonds the stiffener to the sacrificial carrier; forming a careless build-up circuitry on the supporting board in contact with the bump and the stiffener; and removing the bump to form a cavity and expose the electrical pad from a closed end of the cavity; wherein the cavity is laterally covered and surrounded by the adhesive. A semiconductor device can be mounted on the cavity substrate and electrically connected to the electrical pad. The careless buildup circuitry provide signal routing for the semiconductor device while the built-in stiffener can provide adequate mechanical support for the careless build-up circuitry and the semiconductor device.