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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10361151 B1

PDFFull Text
Date of Patent:
Jul. 23, 2019

Filed:

Dec. 06, 2016

Wiring board having isolator and bridging element and method of making wiring board

Applicant:

Bridge Semiconductor Corporation, Taipei, TW;

Inventors:

Charles W. C. Lin, Singapore, SG;

Chia-Chung Wang, Hsinchu County, TW;

Assignee:

BRIDGE SEMICONDUCTOR CORPORATION, Taipei, TW;

Attorneys:

Pai Patent & Trademark Law Firm

Chao-Chang David Pai

Primary Examiner:

Michael N Orlando

Assistant Examiner:

Elizabeth Bradford

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4853 (2013.01); H01L 23/3675 (2013.01); H01L 23/49811 (2013.01); H01L 23/49894 (2013.01); H01L 23/564 (2013.01); H05K 1/0204 (2013.01); H05K 1/142 (2013.01); H01L 25/0753 (2013.01); H01L 33/64 (2013.01); H01L 2224/18 (2013.01); H05K 3/4694 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/049 (2013.01); H05K 2203/063 (2013.01); Y02P 70/611 (2015.11);
Abstract

A wiring board includes a low CTE (coefficient of thermal expansion) and high thermal conductivity isolator incorporated in a resin laminate by an adhesive and a bridging element disposed over the isolator and the resin laminate and electrically coupled to a first routing circuitry on the isolator and a second routing circuitry on the resin laminate. The isolator provides CTE-compensated contact interface for a semiconductor chip to be assembled thereon, and also provides primary heat conduction for the chip. The bridging element offers a reliable connecting channel for interconnecting contact pads on the isolator to terminal pads on the resin laminate.

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