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For the Inventor, By the Inventor

Taipei, Taiwan

Brodge Semiconductor Corporation


USPTO Granted Patents = 1

% Expired Patents = 100.0

Forward Citations = 10

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2 inventors (with patents filed for the assignee):

goldMedal Charles W C Lin (1 out of 172 patents)

silverMedal Chia-Chung Wang (1 out of 103 patents)


1 patent:

1. 9318411 - Semiconductor package with package-on-package stacking capability and method of manufacturing the same (2016-04-19),
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USPTO Data Jan 1 1976 - Sep 22 2026

1 Patents

#2,229 in Taipei

#6,124 in Taiwan

Taipei, TW
Taipei, Taiwan

Brodge Semiconductor Corporation

Forward Citations = 10

2 inventors:

goldMedal Charles W C Lin (1 out of 172 patents)

silverMedal Chia-Chung Wang (1 out of 103 patents)

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